Odisha to Host Second Semiconductor Unit by SiCSem
New facility to boost ESDM ecosystem, generate employment and strengthen India’s semiconductor mission
Bhubaneswar : Odisha is set to strengthen its presence in India’s semiconductor sector as SiCSem Pvt Ltd, a subsidiary of Archean Chemical Industries Ltd, will lay the foundation stone for the state’s second semiconductor manufacturing unit on November 1. The event is expected to be attended by Chief Minister Mohan Charan Majhi and Union Minister for Electronics and IT Ashwini Vaishnaw, highlighting the project’s national importance.
SiCSem has been allotted 23 acres of land by the Industrial Infrastructure Development Corporation (IDCO) at EMC Park in Infovalley near Bhubaneswar. With an investment of ₹2,067 crore, the company will establish a state-of-the-art compound semiconductor manufacturing facility. The plant will produce 60,000 silicon carbide (SiC) wafers annually and package nearly 96 million MOSFETs and diodes. These components are vital for high-performance applications in electric vehicles, renewable energy systems, power grids and other emerging technologies.
The project is expected to create around 1,000 direct jobs and numerous indirect employment opportunities through supporting industries and service providers. This initiative will not only enhance Odisha’s industrial capabilities but also place it among the leading semiconductor manufacturing destinations in India.
The SiCSem project is one of two semiconductor initiatives approved under the India Semiconductor Mission (ISM). Another SiC manufacturing facility is being developed by RIR Power Electronics at the same location with a total investment of around ₹620 crore. Together, these projects signify Odisha’s rapid rise in the Electronics System Design and Manufacturing (ESDM) sector.
SiCSem’s promoters, led by Archean Chemical Industries Managing Director Ranjit Pendurthi, had earlier met Chief Minister Majhi during the Semicon India 2025 event in Delhi to fast-track the project’s implementation.
To enhance research capabilities, SiCSem established the Silicon Carbide Research and Innovation Centre (SICRIC) at IIT-Bhubaneswar. This R&D facility, set up with an investment of ₹64 crore, was inaugurated in January during the Utkarsh Odisha conclave. The centre focuses on developing advanced SiC technologies, fostering innovation and building local expertise in semiconductor research.
Adding further momentum to Odisha’s semiconductor ecosystem, US-based 3D Glass Solutions (3DGS) Inc is set to establish an advanced packaging and embedded glass substrate manufacturing unit at the same ESDM park in Info Valley-II. This project involves an investment of ₹1,943 crore and will complement the semiconductor manufacturing activities by providing high-end packaging solutions.
The simultaneous development of manufacturing, research and advanced packaging infrastructure positions Odisha as a rising semiconductor hub in eastern India. It reflects the state’s commitment to attracting high-tech industries and creating a conducive environment for innovation, investment and skilled employment.
With the foundation-laying of SiCSem’s new facility, Odisha moves closer to becoming a significant player in India’s semiconductor mission, supporting national goals of technological self-reliance, clean energy adoption and industrial growth.
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