Odisha Signs Rs 2,655 Crore MoUs at SEMICON India 2025
CM Majhi pitches state as India’s next semiconductor hub
Bhubaneswar : Odisha Chief Minister Mohan Charan Majhi announced that the state has signed Memorandums of Understanding (MoUs) worth Rs 2,655 crore with leading firms for setting up semiconductor and advanced electronics units. The agreements were inked during the SEMICON India 2025 Conclave in New Delhi, where Odisha showcased its ambitious roadmap to emerge as a semiconductor powerhouse.
According to the Chief Minister, TopTrack Hi-Tech PCB Pvt Ltd signed an MoU worth Rs 1,005 crore, while Sancode Tech, in partnership with Silicon Connect, Inari Amertron Berhad and APIRC Penang, committed Rs 1,650 crore. “These partnerships reaffirm Odisha’s growing appeal as a destination for high-tech manufacturing and global collaborations,” Majhi said in a social media post.
The Chief Minister also engaged with global technology majors such as Intel, Micron, Western Digital, Renesas, and Siemens, marking a decisive step toward integrating Odisha into the global semiconductor value chain.
Majhi inaugurated the Odisha Pavilion at the conclave, highlighting the state’s Semiconductor Manufacturing & Fabless Policy 2025 and Electronics Component Manufacturing (ECM) Policy 2025. “With landmark projects under the India Semiconductor Mission, we are committed to creating a world-class ecosystem for innovation, manufacturing, and investment,” he said.
The pavilion presented Odisha as a preferred global hub for semiconductors, attracting attention from investors and policymakers alike.
The Odisha Electronics and IT Department revealed that the groundbreaking ceremony for SiCSem’s semiconductor plant is expected in mid-October 2025. The project represents a big leap in strengthening India’s chip manufacturing ecosystem.
Another firm, RIR Power Electronics, is preparing to launch its SiC wafer fabrication in December 2025. “Their clean room will be ready by September 2025, and a packaging dry run is scheduled for March 2026,” the department announced. The project benefits from RIR’s technological tie-up with Taiwan for six-inch SiC wafers.
A highlight of the agreements is the plan to set up a high-value skilling centre for Odisha’s youth under the MoU with Sancode Tech and its partners. The initiative also aims to foster government-to-government (G2G) collaboration with Malaysia, positioning Odisha as a hub for VLSI design and packaging excellence.
In addition, Renesas Global expressed interest in forming joint ventures and collaborating with IIT Bhubaneswar to train youth in embedded design. The partnership will bring RenesasC2S benefits directly to Odisha’s next generation of engineers.
By attracting major investments and forging global partnerships, Odisha is positioning itself at the forefront of India’s semiconductor growth story. The state’s policies, combined with the support of the India Semiconductor Mission, provide a strong foundation for future developments.
“These MoUs and partnerships are not just about investment, but about creating opportunities for our youth, empowering local industries, and ensuring Odisha plays a pivotal role in India’s journey towards technological self-reliance,” Majhi said.
The conclave marked a historic moment for Odisha, setting the stage for rapid growth in semiconductors, advanced electronics, and skill development in the coming years.
