Intel CEO’s Visit to Odisha to Mark Groundbreaking of Semiconductor Plant
3D Glass Solutions and SicSem projects set to create jobs, attract investments, and position Odisha as India’s chip-making hub
Bhubaneswar: Odisha is preparing for a landmark moment in its semiconductor journey, with Intel CEO Lip-Bu Tan expected to visit the state later this year for the groundbreaking ceremony of 3D Glass Solutions’ (3DGS) semiconductor plant. A senior state official confirmed that this will mark the beginning of one of the largest technology projects in Odisha’s industrial history.
Principal Secretary of the Electronics and IT Department, Vishal Kumar Dev, said the state is also gearing up for the groundbreaking of SicSem’s Silicon Carbide facility next month. “The Chief Minister Mohan Charan Majhi was here recently, and both SiCSem and 3DGS have confirmed their plans. SicSem’s groundbreaking will take place next month, while 3DGS is waiting for a date from Intel’s CEO. His visit is likely within the next two to three months,” Dev told PTI.
3D Glass semiconductor unit in Odisha
The 3D Glass semiconductor packaging plant, being developed by Heterogeneous Integration Packaging Solutions Pvt Ltd, will be backed by global tech giants such as Intel, Lockheed Martin, and Applied Materials. With an investment of ₹1,943 crore, the facility aims to produce nearly 5 crore units annually. This project marks the first direct involvement of Intel Corporation in Odisha, underlining the state’s rising importance in India’s semiconductor ecosystem.
The 3DGS unit alone is expected to generate around 1,500 direct jobs and nearly 5,000 indirect jobs in allied sectors such as logistics, construction, testing, and component supply chains.
India’s first Silicon Carbide fabrication facility
In a parallel development, SicSem, in collaboration with UK-based Clas-SiC Wafer Fab, will set up India’s first integrated Silicon Carbide (SiC)-based compound semiconductor fabrication facility at InfoValley in Bhubaneswar. With this, Odisha is set to emerge as a pioneering state in advanced chip technologies.
Another company, RIR Power Electronics, has also committed to the sector. The firm’s SiC wafer fabrication plant, with an investment of ₹618 crore, is already operational and is expected to begin commercial production by March 2026. Together, the SicSem and RIR Power projects are expected to create more than 1,000 direct jobs for highly skilled engineers, researchers, and technicians, along with 3,000–4,000 indirect employment opportunities.
Odisha’s semiconductor policy to attract talent
To sustain this momentum, the Odisha government has introduced a revised semiconductor policy to attract both investment and skilled manpower. Under the policy, the state will provide incentives equivalent to 50% of the support offered by the central government. Additionally, to nurture homegrown talent, engineering students opting for semiconductor studies will be offered stipends of around ₹10,000 and support for developing their own commercial chips.
The state also plans to set up dedicated training programs and incubation centres to ensure a steady supply of skilled professionals for these projects.
Economic impact and Odisha’s digital future
Officials believe that these projects will not only transform Odisha into a semiconductor hub but also generate thousands of high-value jobs, spur ancillary industries, and drive innovation. Industry experts estimate that the combined projects could contribute over ₹10,000 crore to Odisha’s economy in the next decade, boosting exports and significantly enhancing the state’s share in India’s electronics manufacturing sector.
“This is a golden opportunity for Odisha to position itself on the global semiconductor map. With both domestic and international players showing interest, the state is fast emerging as a preferred destination for electronics and chip manufacturing,” an industry insider noted.
If executed as planned, Odisha will soon host the nation’s first SiC-based fabrication unit and one of the country’s largest packaging facilities, placing it at the heart of India’s semiconductor mission. With Intel’s CEO set to personally attend the groundbreaking, the developments signal strong global confidence in Odisha’s capabilities and its readiness to lead India’s push toward self-reliance in advanced technologies.
